MOU was signed between Japan Osaka University Joining and Welding Research Institute and our University

Hülya Gedik, Chairman of the Board of Trustees of our University, and our Rector Prof. Dr. Ahmet Kesik and faculty members of our University hosted Director of the Japan Osaka University Joining and Welding Research Institute, Prof. Manabu Tanaka and the delegation headed by internationally renowned robot manufacturer OTC DAHEN R&D Director Tomoyuki Ueyama.

MOU was signed between Osaka University Joining and Welding Research Institute and our University.

Within the scope of cooperation; Researches, projects and academic studies on welding and additive manufacturing will be carried out, as well as student and lecturer exchanges.